PCB Rogowski coil figure sources

Development timeline

/images/research/pcb-rogowski/development-timeline.webp is Fulong Li’s own timeline figure from the 2022 review of Rogowski coil development (40 references), supplied by the author on 29 October 2026 and published unchanged (2000 × 900 pixels). The bracketed numbers refer to the reference list of that review.

Drawn figure

/images/research/pcb-rogowski/winding-shapes.svg was drawn for the website on 29 October 2026 in the shared site palette. It sketches in three dimensions the four patterns of Figure 5 in M. Koga, M. Tsukuda, K. Nakashima and I. Omura, “Application-specific micro Rogowski coil for power modules: design tool, novel coil pattern and demonstration,” CIPS 2016 (open-access copy: http://hdl.handle.net/10228/5769). The maximum outside-current errors (7%, 10%, 26%, 218%) and the 4% front-side value quoted on the page are taken from Section 3.2 of that paper.

Design figure

/images/research/pcb-rogowski/coil-designs.png places side by side the coil areas (left 198 pixels, full height) cropped from images/RogT1_t.png to images/RogT5_t.png in the PCB-Rogowski-Coil repository at commit f1f8c6b (CC BY 4.0, Fulong Li). The crops are not rescaled or recoloured; the white gaps between them are added. The pattern, return-line and outline labels follow each board’s silkscreen.